Navrachna Foundation for Entrepreneurship Development

AI Based Glue Inspection System

E-card manufacturers face issues with glue
smearing on chips, causing defects. Our system
uses Machine Vision and Artificial Intelligence to
inspect glue application automatically. It detects
faults early, preventing defective cards from
reaching the market, reducing waste, and protecting
the company’s reputation for quality.

Field Details
Mentor Mr. Saurav Kumar
Mentee Mr. Yash Kumar
Patent Status NO
Patent ID
Expenditure (in Rs) 220310